MARYANI, Edna; JAYA, Pratama. Reducing Packaging Defects in Wheat Flour Production Using Soft Systems Methodology. Golden Ratio of Mapping Idea and Literature Format, [S. l.], v. 6, n. 2, p. 1559–1575, 2026. DOI: 10.52970/grmilf.v6i2.1990. Disponível em: https://goldenratio.id/index.php/grmilf/article/view/1990. Acesso em: 7 may. 2026.